Numerical Analysis of Effective Thermal Conductivity of Microwire Array Element

被引:0
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作者
Takashi Komine
Masahiro Kuraishi
Takayuki Teramoto
Ryuji Sugita
Yasuhiro Hasegawa
Masayuki Murata
Daiki Nakamura
机构
[1] Ibaraki University,Department of Media and Telecommunications Engineering, Faculty of Engineering
[2] Saitama University,Graduate School of Science and Engineering
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关键词
Thermal conductivity; wire array element; thermoelectric material; finite-element analysis;
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摘要
We have used the finite-element method to calculate numerically the equations of electrical and thermal transport. The thermal conductivity of a wire array is analyzed. The influence of the wire array on the effective thermal conductivity of the element is discussed. The effective thermal conductivity decreases as the wire diameter is reduced. Decreasing the packing density significantly reduces the effective thermal conductivity. In the classical regime, the ratio of the effective electrical conductivity to the effective thermal conductivity of the wire array can be expressed as a function of packing density; this ratio decreases as the packing density decreases. The ratio for a wire array with realistic parameters is similar to that of bulk bismuth. Therefore, to improve the thermoelectric figure of merit, it is critical to enhance the intrinsic power factor in a wire by exploiting thermomagnetic or quantum effects.
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页码:1606 / 1610
页数:4
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