Corrosion and inhibition of copper in different electrolyte solutions

SO4 at pH≈3, respectively, were studied. The corrosion and inhibition processes were monitored by in-situ atomic force microscopy, and morphological changes on the electrode surface were registered. The p-Cl-BHA greatly enhanced the resistance of copper to pitting corrosion in an aqueous solution containing chloride ions. This effect is attributed to the formation of a continuous protective chemisorbed layer on the corroding metallic surface through which Cu2O will be stabilized. The DBSO, because of its adsorption and conversion to a more stable, less soluble sulphide compound, greatly hindered the copper corrosion in the sulphate-containing solutions.