Wetting and Interfacial Chemistry of Sn-Zn-Ga Alloys with Cu Substrate

Wetting of Cu pads by Sn-Zn eutectic-based alloys with 0.1, 0.2, 0.5, and 1.0 wt.% of Ga was studied using the sessile drop method in the presence of ALU33® flux. Wetting tests were performed at 250 °C after 60, 180, 480, 900, 1800, and 3600 s of contact, and at 230, 280, 320 °C for a contact time of 480 s. After cleaning the flux residue from solidified samples, the spreadability of Sn-Zn-Ga on Cu was determined in accordance with ISO 9455-10:2013-03. Selected, solidified solder-pad couples were cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy and x-ray diffraction study of the interfacial microstructure. Growth of the intermetallic Cu5Zn8 and CuZn4 phase layers was studied at the solder-pad interface. Samples after spreading test at 250 °C for 60 s were subjected to aging for 1, 10, and 30 days at 170 °C.