Growth and electrical properties of the (Si/Ge)-on-insulator structures formed by ion implantation and subsequent hydrogen-assisted transfer

被引:0
|
作者
I. E. Tyschenko
M. Voelskow
A. G. Cherkov
V. P. Popov
机构
[1] Russian Academy of Sciences,Institute of Semiconductor Physics, Siberian Branch
[2] Research Center Dresden-Rossendorf,Institute of Ion Beam Physics and Materials Research
来源
Semiconductors | 2009年 / 43卷
关键词
61.72.Ww; 68.55.-a; 73.40.Ty; 73.50.Dn; 81.20.Vj; 81.40.Ef;
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摘要
Systematic features of endotaxial growth of intermediate germanium layers at the bonding interface in the silicon-on-insulator structure consisting of buried SiO2 layer implanted with Ge+ ions are studied in relation to the annealing temperature. On the basis of the results for high-resolution electron microscopy and thermodynamic analysis of the Si/Ge/SiO2 system it is assumed that the endotaxial growth of the Ge layer occurs via formation of a melt due to enhanced segregation and accumulation of Ge at the Si/SiO2 interface. Effect of germanium at the bonding interface on the Hall mobility of holes in silicon layers with nanometer-scale thickness is studied. It is found that the structures including the top silicon layer with the thickness 3–20 nm and incorporating germanium feature the hole mobility that exceeds by a factor of 2–3 the hole mobility in corresponding Ge-free silicon-on-insulator structures.
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页码:52 / 56
页数:4
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