Effect of technological factors on the diffusion kinetics in the copper-aluminum composite

被引:0
|
作者
Yu. P. Trykov
O. V. Slautin
V. N. Arisova
V. G. Shmorgun
I. A. Ponomareva
机构
[1] Volgograd State Technical University,
关键词
Thermal Treatment; Diffusion Layer; Protective Coating; AlCu; Welding Zone;
D O I
10.1007/s11981-008-1009-1
中图分类号
学科分类号
摘要
An investigation is performed on the effect of thermal treatment conditions, furnace atmosphere, and technological protective coatings of various compositions on the formation of the phase composition of diffusion layers in welding zones of a layered intermetallic composite of the Cu-Al system produced by complex technology.
引用
收藏
页码:42 / 48
页数:6
相关论文
共 50 条
  • [1] Effect of Technological Factors on the Diffusion Kinetics in the Copper-Aluminum Composite
    Trykov, Yu. P.
    Slautin, O. V.
    Arisova, V. N.
    Shmorgun, V. G.
    Ponomareva, I. A.
    RUSSIAN JOURNAL OF NON-FERROUS METALS, 2008, 49 (01) : 42 - 48
  • [3] Effect of Micro-alloying on Copper-Aluminum Composite Sheets
    Zheng, Sulu
    Huang, Zengyang
    Zheng, Zhiyun
    Mao, Yunyan
    He, Shenxi
    Xu, Renliu
    Wang, Dongdong
    MACHINERY, MATERIALS SCIENCE AND ENERGY ENGINEERING, 2015, : 331 - 337
  • [4] COPPER-ALUMINUM SURPRISE
    BINDEL, TH
    JOURNAL OF CHEMICAL EDUCATION, 1990, 67 (02) : 165 - 166
  • [5] MUTUAL DIFFUSION IN BETA-PHASE OF COPPER-ALUMINUM SYSTEM
    PIMENOV, VN
    AKKUSHKAROVA, KA
    UGASTE, YE
    FIZIKA METALLOV I METALLOVEDENIE, 1975, 39 (04): : 821 - 827
  • [6] FORMATION KINETICS OF ALPHA 2 PHASE OF COPPER-ALUMINUM ALLOY
    DUVAL, P
    HAYMANN, P
    JOURNAL DE MICROSCOPIE, 1971, 11 (01): : 7 - +
  • [7] Effect of Temperature on the Corrosion Behavior and Corrosion Resistance of Copper-Aluminum Laminated Composite Plate
    Li, Qiannan
    Zhang, Yifan
    Cheng, Yulin
    Zuo, Xiaojiao
    Wang, Yinxiao
    Yuan, Xiaoguang
    Huang, Hongjun
    MATERIALS, 2022, 15 (04)
  • [8] Luminescence of copper-aluminum diselenide
    V. A. Savchuk
    B. V. Korzun
    N. A. Sobolev
    L. A. Makovetskaya
    Semiconductors, 1997, 31 : 315 - 318
  • [9] THE YTTERBIUM COPPER-ALUMINUM SYSTEM
    STELMAKHOVYCH, BM
    KUZMA, YB
    BABIZHETSKY, VS
    JOURNAL OF ALLOYS AND COMPOUNDS, 1993, 190 (02) : 161 - 164
  • [10] Luminescence of copper-aluminum diselenide
    Savchuk, VA
    Korzun, BV
    Sobolev, NA
    Makovetskaya, LA
    SEMICONDUCTORS, 1997, 31 (03) : 315 - 318