Influence of a flux of high-velocity microparticles on the parameters of integrated circuits placed behind a thick-walled obstacle

被引：0

作者：

Belous A.I. ^{[1
]}

Dybov O.A. ^{[2
]}

Romanov G.S. ^{[3
]}

Petlitskaya T.V. ^{[1
]}

Usov G.I. ^{[1
]}

机构：

[1] Belmikrosistemy Unitary Enterprise, Minsk

[2] Scientific-Research Institute of Pulsed Processes with Pilot Production, Minsk

[3] A. V. Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus, Minsk, 220072

来源：

Journal of Engineering Physics and Thermophysics | 2004年 / 77卷 / 4期

关键词：

Experimental Data; Statistical Physic; Integrate Circuit; Space Particle; Metal Obstacle;

D O I：

10.1023/B:JOEP.0000045161.32924.c8

中图分类号：

学科分类号：

摘要：

Experimental data showing that on collision of a flux of high-velocity microparticles (which is close to the fluxes of space particles in parameters) with a thick-walled metal obstacle we have failure of integrated circuits placed behind this obstacle have been given. © 2004 Springer Science+Business Media, Inc.

引用

页码：773 / 775

页数：2

共 3 条

[1] Damage of integrated circuits by high-velocity microparticles penetrating thick-wall obstacles
Roman, OV
Dybov, OA
Romanov, GS
Usherenko, SM
[J]. TECHNICAL PHYSICS LETTERS, 2005, 31 (01) : 46 - 47
[2] Damage of integrated circuits by high-velocity microparticles penetrating thick-wall obstacles
O. V. Roman
O. A. Dybov
G. S. Romanov
S. M. Usherenko
[J]. Technical Physics Letters, 2005, 31 : 46 - 47
[3] Lateral high-velocity impact action of prefabricate fragments on a thick-walled tube
Zhu G.-L.
Li W.-B.
Wang X.-M.
Li W.-B.
[J]. Zhendong yu Chongji/Journal of Vibration and Shock, 2016, 35 (05): : 115 - 119

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