Microstructuring of fused silica using femtosecond laser pulses of various wavelengths

Experimental results on ablation and microstructuring of fused silica (Corning 7980 HPFS Standard Grade) using femtosecond laser pulses will be presented. In particular, the ablation behavior of the material at the laser wavelengths of 775, 387 and 258 nm was investigated. The qualities of selected microstructures produced at the different wavelengths are compared with respect to roughness, crack formation and exactness. The investigations were carried out using an automated microstructuring system equipped with a femtosecond laser Clark-MXR CPA 2010 (1 mJ maximum pulse energy, 1 kHz repetition rate and 150 fs pulse duration). Layer-by-layer ablation is realized for producing 3D microstructures, where the layer thickness depends on the ablated depth per laser pulse. Those ablation depths depend on the material and the laser parameters and were determined for the three wavelengths in preparatory investigations. Therefore, the laser fluence and the pulse-to-pulse distance were varied independently. We will present the results of our fundamental studies on fs-laser ablation at the three wavelengths and show several structures, such as pyramids, half spheres and cones. Best results were obtained at 258 nm wavelength. There, the exactness was highest and the roughness of the surfaces of the structures was lowest. In addition, absolutely no crack formation occurred.