Investigation of through thickness residual stress distribution and springback in bent AL plate by slotting method

被引:0
|
作者
Chun-guo Liu
Yuan Zheng
Xue-guang Zhang
机构
[1] Jilin University (Nanling Campus),Roll Forging Research Institute
关键词
Springback; Residual stress; Bending; Slotting; Finite element (FE) analysis;
D O I
暂无
中图分类号
学科分类号
摘要
Residual stresses generated during the manufacturing process have direct effects on product life cycle and properties. Thus, it is essential to understand the effects of processing on residual stress distribution. In this paper, a technique for through thickness residual stress measurement was developed and tested experimentally. In this technique, a bent plate slotted in the middle of the concave surface leads to springback of the plate. The residual stress distribution and springback induced by local material removal are theoretically analyzed. This “slotting method” is more convenient than other relaxation methods because it is determined directly from the data and does not require tedious inversion; additionally, it allows the determination of a springback map through thickness residual stress distribution. Here, the research object was a 30-mm-thick aluminum alloy plate that had remaining thickness residual stress induced by bending, and the slotting processes were carried out with FE simulation and experiment, respectively. The simulation results on the residual stress distribution shows consistence with the analytical results. Furthermore, the slotting processes with different groove depths and locations were also investigated. The measured springback data shows minor deviation from the numerical analysis, which verifies that the technique provides a reasonable assessment of the through thickness residual stress distribution and springback.
引用
收藏
页码:299 / 308
页数:9
相关论文
共 50 条
  • [1] Investigation of through thickness residual stress distribution and springback in bent AL plate by slotting method
    Liu, Chun-guo (liucg@jlu.edu.cn), 1600, Springer London (90): : 1 - 4
  • [2] Investigation of through thickness residual stress distribution and springback in bent AL plate by slotting method
    Liu, Chun-guo
    Zheng, Yuan
    Zhang, Xue-guang
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 90 (1-4): : 299 - 308
  • [3] Experimental method for residual stress evaluation through the thickness of a plate
    Andersen, LF
    JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 2002, 124 (04): : 428 - 433
  • [4] Through-thickness residual stress measurements on springback test specimens
    Gnaeupel-Herold, T
    Foecke, T
    Iadicola, MA
    Numisheet 2005: Proceedings of the 6th International Conference and Workshop on Numerical Simulation of 3D Sheet Metal Forming Processes, Pts A and B, 2005, 778 : 221 - 221
  • [5] Experimental and numerical investigation of through-thickness residual stress of laser-bent Ti samples
    Kotobi, Mahdi
    Honarpisheh, Mohammad
    JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN, 2017, 52 (06): : 347 - 355
  • [6] EFFECT OF PLATE THICKNESS ON BENDING STRESS DISTRIBUTION AROUND THROUGH CRACKS
    HARTRANFT, RJ
    SIH, GC
    JOURNAL OF MATHEMATICS AND PHYSICS, 1968, 47 (03): : 276 - +
  • [7] DISTRIBUTION OF STRESS INTENSITY THROUGH PLATE THICKNESS ALONG CRACK FRONT
    BONDAROVICH, LA
    ZLOCHEVSKII, AB
    PATSAEV, VN
    CHEBAEVSKII, BP
    INDUSTRIAL LABORATORY, 1978, 44 (01): : 128 - 131
  • [8] The residual stress investigation in Al using β-particles penetration method
    Salehpour, B.
    Pirhoseinloo, H.
    HashJin, M. Taheri
    ALUMINUM ALLOYS: FABRICATION, CHARACTERIZATION AND APPLICATIONS, 2008, : 119 - 123
  • [9] A springback prediction method for double-curved plate bent with the multi-point forming method
    Yue, Tao
    Liu, Chunguo
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART G-JOURNAL OF AEROSPACE ENGINEERING, 2020, 234 (12) : 1939 - 1952
  • [10] A STUDY OF RESIDUAL-STRESS DISTRIBUTION THROUGH THE THICKNESS OF P(+) SILICON FILMS
    CHU, WH
    MEHREGANY, M
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (07) : 1245 - 1250