Atomic-force-microscopy visualization of Si nanocrystals in SiO2 thermal oxide using selective etching

被引:0
|
作者
M. S. Dunaevskii
J. J. Grob
A. G. Zabrodskii
R. Laiho
A. N. Titkov
机构
[1] Russian Academy of Sciences,Ioffe Physicotechnical Institute
[2] Université Louis Pasteur,Laboratoire PHASE
[3] Turku University,Wihuri Laboratory
来源
Semiconductors | 2004年 / 38卷
关键词
SiO2; Phase Precipitation; Average Radius; Oxide Material; Suggested Method;
D O I
暂无
中图分类号
学科分类号
摘要
The topography and local hardness of the etched surfaces of layers of SiO2 thermal oxide that contained Si nanocrystals in its bulk were studied using atomic-force microscopy. The Si nanocrystals were obtained by implanting Si+ ions into the oxide with subsequent high-temperature annealing. It is shown that the use of selective etching that removes the oxide material makes it possible to reveal Si nanocrystals that appear in the profile of etched surfaces in the form of nanohillocks with a height of up to 2–3 nm. These values are in satisfactory agreement with the average radius of Si nanocrystals in the SiO2 oxide layer. Independent confirmation of the Si-nanocrystal observation was obtained by comparing the topography of etched surfaces with the local-hardness maps obtained for the same surfaces; in these maps, the hillocks appear as sites at the surface with a reduced hardness. The phase precipitation of implanted Si is also observed in the form of extended flat clusters oriented in the oxide bulk parallel to the oxide surface. The suggested method for revealing the Si nanocrystals and clusters incorporated into the oxide provides a convenient way to study the specific features of nucleation growth and spinodal decomposition in the Si solid solution in the SiO2 oxide.
引用
收藏
页码:1254 / 1259
页数:5
相关论文
共 50 条
  • [1] Atomic-force-microscopy visualization of Si nanocrystals in SiO2 thermal oxide using selective etching
    Dunaevskii, MS
    Grob, JJ
    Zabrodskii, AG
    Laiho, R
    Titkov, AN
    SEMICONDUCTORS, 2004, 38 (11) : 1254 - 1259
  • [2] SELECTIVE ETCHING OF SIO2 ON SI
    ITOGA, M
    INOUE, M
    KITAHARA, Y
    BAN, Y
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (08) : C284 - C284
  • [3] CHARACTERIZATION OF SIO2 LAYERS ON SI WAFERS USING ATOMIC-FORCE MICROSCOPY
    ZUNIGASEGUNDO, A
    RUIZ, F
    VAZQUEZLOPEZ, C
    GONZALEZHERNANDEZ, J
    TORRESDELGADO, G
    TSU, DV
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (04): : 2572 - 2576
  • [4] Effect of thermal oxidation on Si/SiO2 interface microroughness:: An atomic force microscopy (AFM) study
    Fang, SJ
    Chen, W
    Helms, CR
    Yamanaka, T
    PHYSICS AND CHEMISTRY OF SIO(2) AND THE SI-SIO(2) INTERFACE-3, 1996, 1996, 96 (01): : 338 - 347
  • [5] Nommiformity in ultrathin SiO2 on Si(111) characterized by conductive atomic force microscopy
    Hasunuma, R
    Okamoto, J
    Tokuda, N
    Yamabe, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2004, 43 (11B): : 7861 - 7865
  • [6] SCALING ANALYSIS OF SIO2/SI INTERFACE ROUGHNESS BY ATOMIC-FORCE MICROSCOPY
    YOSHINOBU, T
    IWAMOTO, A
    IWASAKI, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (1B): : 383 - 387
  • [7] Surface morphology of nitrided thin thermal SiO2 studied by atomic force microscopy
    Tallarida, G
    Cazzaniga, F
    Crivelli, B
    Zonca, R
    Alessandri, M
    JOURNAL OF NON-CRYSTALLINE SOLIDS, 1999, 245 : 210 - 216
  • [8] PLASMA REACTOR DESIGN FOR SELECTIVE ETCHING OF SIO2 ON SI
    HEINECKE, RAH
    SOLID-STATE ELECTRONICS, 1976, 19 (12) : 1039 - 1040
  • [9] SELECTIVE ETCHING OF SIO2 RELATIVE TO SI BY PLASMA REACTIVE SPUTTER ETCHING
    MATSUO, S
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (02): : 587 - 594
  • [10] Atomic layer etching of SiO2 using trifluoroiodomethane
    Kim, Seon Young
    Park, In-Sung
    Ahn, Jinho
    APPLIED SURFACE SCIENCE, 2022, 589