Morphological evolution of a void under thermal and mechanical loads

被引：1

作者：

Li E.-L. ^{[1
]}

Chen X. ^{[1
]}

Wang H. ^{[1
]}

Wang X. ^{[1
]}

Li Z.-H. ^{[1
]}

机构：

[1] School of Naval Architecture, Ocean and Civil Engineering, Shanghai Jiaotong University

来源：

Journal of Shanghai Jiaotong University (Science) | 2009年 / 14 E卷 / 01期

基金：

中国国家自然科学基金;

关键词：

Morphological evolution of void; Thermal and mechanical loads; Thermodynamics potential;

D O I：

10.1007/s12204-009-0069-4

中图分类号：

TK1 [热力工程、热机];

学科分类号：

080702 ;

摘要：

A model for the morphological evolution of a void under thermal and mechanical loads is established, and the thermodynamics potential of the model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the void are described, which gives some insight into the reliability of the interconnect under combined thermal and mechanical loads. Copyright.

引用

页码：69 / 72

页数：3

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