Thermal dewetting of thin Au films deposited onto line-patterned substrates

被引：0
|
作者：
Dong Wang
Peter Schaaf
机构：
[1] Institute of Materials Engineering and Institute of Micro- and Nanotechnologies MacroNano®,Department of Materials for Electronics
[2] Ilmenau University of Technology,undefined
来源：
Journal of Materials Science | 2012年 / 47卷
关键词：
Line Width; Void Nucleation; Particle Spacing; Flat Substrate; Rayleigh Instability;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Au films are deposited onto line-patterned substrates, and the dewetting of the line-shaped films is studied. The results show that the line-patterned substrates can clearly lead to both, a decrease and an increase in the resulting particle size and particle spacing when compared to dewetting occurring on a flat substrate. The size and the spacing of the dewetted Au particles scale with the feature size of the line-shaped films in a Rayleigh-like way, but this scaling law ceases when the ratio of line width to film thickness reaches or exceeds a critical value.
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页码：1605 / 1608
页数：3
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