Microstructural Evolution with a Wide Range of Solidification Cooling Rates in a Ni-Based Superalloy

At a wide range of solidification cooling rates in various cooling effect solidification processes, the solid/liquid interface experiences planar, cellular, dendritic, and superfine-cellular morphologies, and an approximately linear correlation is shown between the logarithmic representations of dendrite arm spacing and solidification cooling rate in a Ni-based superalloy. The relationship between dendrite arm spacing and cooling rate was established by statistical analysis data in a wide range of Ni-based superalloys from the literature. It can be used comprehensively to evaluate dendritic growth at given cooling conditions in the fabrication of Ni-based superalloys.