Experiments and simulation on laser bending of silicon sheet with different thicknesses

被引：0
|
作者：
Dong-Jiang Wu
Guang-Yi Ma
Shuang Liu
Xu-Yue Wang
Dong-Ming Guo
机构：
[1] Dalian University of Technology,Key Laboratory for Precision and Non
来源：
Applied Physics A | 2010年 / 101卷
关键词：
Bottom Surface; Brittle Material; Scanning Time; Thick Sheet; Scanning Path;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Based on the requirements for silicon sheets with different thickness in MEMS, and according to the experimental results, the element of the temperature distribution was investigated by calculation with ANSYS, and the bending mechanism of different thicknesses of the silicon sheet is proposed. The results showed that the plastic deformation was delayed as the thickness is increased. The bending angle was bigger with the increment being smaller as the scanning numbers increased, and the biggest bending angle was obtained finally.
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收藏
页码：517 / 521
页数：4
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