Microstructure and Phase Development of Buried Resistors in Low Temperature Co-fired Ceramic

Embedded resistor circuits have been generated with the use of a Micropen system, Ag conductor paste (DuPont 6142D), a new experimental resistor ink from DuPont (E84005-140), and Low Temperature Co-fired Ceramic (LTCC) green tape (DuPont A951). Sample circuits were processed under varying peak temperature ranges (835°C–875°C) and peak soak times (10 min–720 min). Resistors were characterized by SEM, TEM, EDS, and high-temperature XRD. Results indicate that devitrification of resistor glass phase to Celcian, Hexacelcian, and a Zinc-silicate phase occurred in the firing ranges used (835–875°C) but kinetics of divitrification vary substantially over this temperature range. The resistor material appears structurally and chemically compatible with the LTCC. RuO2 grains do not significantly react with the devitrifying matrix material during processing. RuO2 grains coarsen significantly with extended time and temperature and the electrical properties appear to be strongly affected by the change in RuO2 grain size.