Correction to: Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy

被引：0

作者：

Congcong Dong

Peizhen Huang

Jiaming Zhang

机构：

[1] Nanjing University of Aeronautics and Astronautics,State Key Laboratory of Mechanics and Control of Mechanical Structures

来源：

Applied Physics A | 2022年 / 128卷

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引用

共 11 条

[1] Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy
Congcong Dong
Peizhen Huang
Jiaming Zhang
Applied Physics A, 2022, 128
[2] Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy
Dong, Congcong
Huang, Peizhen
Zhang, Jiaming
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 128 (07):
[3] Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy (vol 128, 617, 2022)
Dong, Congcong
Huang, Peizhen
Zhang, Jiaming
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 128 (08):
[4] PHASE-FIELD SIMULATION OF CONDUCTIVE INCLUSION EVOLUTION IN HIGHLY SYMMETRIC ORIENTED SINGLE CRYSTAL METAL INTERCONNECTS UNDER ANISOTROPIC INTERFACE DIFFUSION INDUCED BY ELECTROMIGRATION
Dong, Congcong
Huang, Peizhen
JOURNAL OF MECHANICS OF MATERIALS AND STRUCTURES, 2024, 19 (03) : 373 - 395
[5] Finite element simulation of inclusion evolution in interconnects due to electromigration-induced interface diffusion
Dong, Congcong
Huang, Peizhen
ARCHIVE OF APPLIED MECHANICS, 2023, 93 (03) : 1081 - 1094
[6] Finite element simulation of inclusion evolution in interconnects due to electromigration-induced interface diffusion
Congcong Dong
Peizhen Huang
Archive of Applied Mechanics, 2023, 93 : 1081 - 1094
[7] PHASE FIELD SIMULATION OF THE INCLUSION INSTABILITY AND SPLITTING PROCESSES IN INTERCONNECTS DUE TO INTERFACE DIFFUSION INDUCED BY ELECTROMIGRATION
Zhou, Linyong
Huang, Peizhen
Zhang, Jiaining
JOURNAL OF MECHANICS OF MATERIALS AND STRUCTURES, 2023, 18 (01) : 39 - 58
[8] Multi-phase-field simulation of the void crossing grain boundary under electromigration-induced anisotropic surface diffusion in (110)-oriented interconnects
Guo, Yuanzhe
Huang, Peizhen
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2025, 131 (04):
[9] Finite-Element Crystal Plasticity on Phase-Field Microstructures: Predicting Mechanical Response Variations in Ni-Based Single-Crystal Superalloys
Le Graverend, Jean-Briac
Harikrishnan, Rajendran
JOM, 2019, 71 (08) : 2600 - 2611
[10] Finite-Element Crystal Plasticity on Phase-Field Microstructures: Predicting Mechanical Response Variations in Ni-Based Single-Crystal Superalloys
Jean-Briac le Graverend
Rajendran Harikrishnan
JOM, 2019, 71 : 2600 - 2611

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