Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

被引：0
|
作者：
L. P. Lehman
S. N. Athavale
T. Z. Fullem
A. C. Giamis
R. K. Kinyanjui
M. Lowenstein
K. Mather
R. Patel
D. Rae
J. Wang
Y. Xing
L. Zavalij
P. Borgesen
E. J. Cotts
机构：
[1] Binghamton University,Department of Physics and the Materials Science Program
[2] SUNY,undefined
[3] Universal Instruments Corporation,undefined
来源：
Journal of Electronic Materials | 2004年 / 33卷
关键词：
Sn-Ag-Cu; solder; intermetallic compounds;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The microstructure of the Sn-Ag-Cu solder is examined by optical microscopy and scanning electron microscopy (SEM) for various compositions near the ternary eutectic for different cooling rates from the solder melt. Focus is on the size and orientation of Sn grains as indicated by cross-polarized, light optical microscopy, and pole figures from x-ray diffraction. We find that both composition and cooling rate have strong influences on Sn grain size, with Sn grain size increasing an order of magnitude as Cu concentration increases from 0% to 1.1%. Cyclic growth twinning, with twinning angles near 60°, is observed in Sn-Ag-Cu alloys near the composition Sn-3.9Ag-0.6Cu.
引用
收藏
页码：1429 / 1439
页数：10
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