The Effect of Fillers on Thermal-Conductivity Materials Based on Silicon–Organic Oligomers (Review)

被引：0
|
作者：
Ilyukhina M.A. [1 ]
Petrova A.P. [1 ]
Timonin V.V. [1 ]
机构：
[1] All-Russian Research Institute of Aviation Materials, Moscow
来源：
Polymer Science - Series D | 2022年 / 15卷 / 02期
关键词：
dispersion degree; fillers; fractions; organosilicon polymers; polymers; sealants; thermal conductivity; volumetric filling; vulcanizers;
D O I：
10.1134/S1995421222020058
中图分类号：
学科分类号：
摘要：
Abstract: In this paper, we analyze and generalize survey information on the use of fillers of various chemical natures in the composition of organosilicon compositions based available literature data. Methods for increasing thermal conductivity by using fillers of various nature and dispersion are considered. © 2022, Pleiades Publishing, Ltd.
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页码：232 / 239
页数：7
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