Localized relaxation theory of circuits and its applications in electro-thermal analyses

被引:0
|
作者
ZuYing Luo
GuoXing Zhao
Joseph A. Gordon
Sheldon X. -D. Tan
机构
[1] Beijing Normal University,College of Information Science and Technology
[2] University of California,Department of Electrical Engineering
来源
关键词
integrated circuit; electro-thermal analysis; SOR algorithm; power/ground network;
D O I
暂无
中图分类号
学科分类号
摘要
In the high-performance IC design with increasing design complexity, it is a very important design content to efficiently analyze IC parameters. Thus, the electro-thermal (ET) analyses including power/ground (P/G) analysis and thermal analysis are hot topics in today’s IC research. Since ET analysis equation has a sparse, positive definite and strictly diagonally dominant coefficient-matrix, we prove that the ET analysis has the advantage of locality. Owing to this advantage, localized relaxation method is formally proposed, which has the same accuracy as the global relaxation done with the constraint of the same truncation error limitation. Based on the localized relaxation theory, an efficient and practical localized successive over-relaxation algorithm (LSOR2) is introduced and applied to solve the following three ET analysis problems. (1) Single-node statistical voltage analysis for over-IR-drop nodes in P/G networks; (2) single-node statistical temperature analysis for hot spots in 3D thermal analysis; (3) fast single open-defect analysis for P/G networks. A large amount of experimental data demonstrates that compared with the global successive over-relaxation (SOR) algorithm, LSOR2 can speed up 1–2 orders of magnitudes with the same accuracy in ET analyses.
引用
收藏
页码:938 / 950
页数:12
相关论文
共 50 条
  • [1] Localized relaxation theory of circuits and its applications in electro-thermal analyses
    Luo ZuYing
    Zhao GuoXing
    Gordon, Joseph A.
    Tan, Sheldon X-D
    SCIENCE CHINA-INFORMATION SCIENCES, 2012, 55 (04) : 938 - 950
  • [2] Localized relaxation theory of circuits and its applications in electro-thermal analyses
    GORDON Joseph A.
    TAN Sheldon X.-D.
    Science China(Information Sciences), 2012, 55 (04) : 938 - 950
  • [3] Development of all metal electro-thermal actuator and its applications
    Luo, JK
    He, JH
    Flewitt, AJ
    Moore, DF
    Spearing, SM
    Fleck, NA
    Milne, WI
    MEMS/MOEMS COMPONENTS AND THEIR APPLICATIONS, 2004, 5344 : 201 - 210
  • [4] Electro-thermal simulation of semiconductor devices and hybrid circuits
    Menozzi, R.
    De Iaco, E.
    Sozzi, G.
    Cova, P.
    Delmonte, N.
    Zampardi, P.
    Kwok, K.
    Cismaru, C.
    Metzger, A.
    2006 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES, 2006, : 1 - +
  • [5] Electro-thermal coupling analysis methodology for RF circuits
    Gomez, Didac
    Dufis, Cedric
    Altet, Josep
    Mateo, Diego
    Luis Gonzalez, Jose
    MICROELECTRONICS JOURNAL, 2012, 43 (09) : 633 - 641
  • [6] Electro-thermal simulation of dynamic circuits in the time domain
    Brambilla, A
    DAmore, D
    PESC 96 RECORD - 27TH ANNUAL IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS I AND II, 1996, : 570 - 574
  • [8] Lifetime of CMOS Circuits Evaluation by Means of Electro-thermal Simulations
    Garci, Maroua
    Kammerer, Jean-Baptiste
    Hebrard, Luc
    2013 19TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2013, : 122 - 126
  • [9] Electro-thermal high-level modeling of integrated circuits
    Krencker, J. C.
    Kammerer, J. B.
    Herve, Y.
    Hebrard, L.
    MICROELECTRONICS JOURNAL, 2014, 45 (05) : 491 - 499
  • [10] Electro-thermal High-Level Modeling of Integrated Circuits
    Krencker, Jean-Christophe
    Kammerer, Jean-Baptiste
    Herve, Yannick
    Hebrard, Luc
    2012 18TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2012, : 71 - 75