Fabrication and thermal stability of a nanocrystalline Ni–Al–Cr alloy: Comparison with pure Cu and Ni

A Ni–Al–Cr alloy with an initial grain size of ∼60 μm was subjected to torsion straining to a strain of ∼7 at room temperature, thereby reducing the grain size to ∼34 nm. Similar torsion straining with samples of pure Cu and pure Ni gave grain sizes of ∼170 and ∼130 nm, respectively. Inspection of the Ni–Al–Cr alloy after torsion straining revealed highly strained regions containing dislocations associated with lattice distortions but with an absence of any Ni3Al ordered phase. The ultrafine grains in the Ni–Al–Cr alloy were extremely stable at high temperatures, and it was possible to retain a grain size of less than 100 nm after annealing at temperatures up to ∼900 K. By contrast, there was rapid grain growth in the samples of pure Cu and Ni at annealing temperatures in the vicinity of ∼500 K. The stability of the grains in the Ni–Al–Cr alloy is attributed to the formation of a Ni3Al-based ordered phase after annealing at ∼650–700 K. The presence of this phase also leads to an apparent negative slope in the standard Hall–Petch relationship.