Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material

被引：0
|
作者：
K. S. Siow
S. T. Chua
机构：
[1] Universiti Kebangsaan Malaysia,Institute of Microengineering and Nanoelectronics
来源：
Metals and Materials International | 2020年 / 26卷
关键词：
Sintered silver; Lead-free; Diffusion; Mechanical properties; Microstructure; Oxidation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：1404 / 1414
页数：10
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