On the effect of lead concentration on the kinetics of contact melting in the Sn–Pb–Bi system in the presence of electromigration

被引：0
|
作者：
Afashokov V.Z. [1 ]
Akhkubekov A.A. [1 ]
Akhkubekova S.N. [1 ]
Zubkhadjiev M.-A.V. [1 ]
Khubolov B.M. [1 ]
机构：
[1] Kabardino-Balkarian State University, Nalchik, Kabardino-Balkaria
来源：
Journal of Surface Investigation. X-ray, Synchrotron and Neutron Techniques | 2016年 / 10卷 / 4期
关键词：
contact layer; contact melting; electromigration; liquid-solid alloys; phase formation;
D O I：
10.1134/S1027451016040030
中图分类号：
学科分类号：
摘要：
It is determined by electron microscopy that the contact layer in the Sn–(Bi + 30 wt % Pb) system contains separate solid inclusions, while the contact layer in the Sn–(Bi + 40 wt % Pb) system is microheterogeneous. The observed structural states of alloys in the contact layers are explained by a change in the concentration of the initial contacting samples. The effect of the alloy structure and electromigration on the kinetics of contact melting is found. © 2016, Pleiades Publishing, Ltd.
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页码：763 / 766
页数：3
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