Optimization of control parameters in micro hot embossing

被引:0
|
作者
Yong He
Jian-Zhong Fu
Zi-Chen Chen
机构
[1] Zhejiang University,Department of Mechanical Engineering
来源
Microsystem Technologies | 2008年 / 14卷
关键词
PMMA; Pattern Defect; Pattern Quality; Fine Pattern; Optimize Control Parameter;
D O I
暂无
中图分类号
学科分类号
摘要
The key control parameters in hot embossing (such as the imprint pressure, the imprint temperature, the holding time and the demolding temperature) can significantly impact on the pattern quality. The finite element method was used to analyze the embossing, cooling and demolding step to acquire the optimized process parameters. The simulation results show that the polymer flow has a reference to the imprint pressure, the imprint temperature and the holding time. While the adhesion force between the polymer and the mold can significantly influence the replication accuracy. Because of polymer flow, non-uniform pressure distribution can be observed and this results in the pattern height difference. The hydraulic pressure system was designed to acquire uniform pressure. Thermal stress caused by the difference of the thermal expansion coefficients between the mold and the polymer can induce stress concentration at the corner. If the demolding direction is not vertical to horizon, another stress concentration will appear. Excessive stress results in defects and causes fracture at the base part of the pattern during the demolding step. To eliminate the defects, cooling to a relative high temperature was introduced to reduce the stress concentration and an auto-demolding device was used to insure no additional stress was imported at the demolding step. The following experiment showed the successful fabrication of fine patterns with the optimized parameters.
引用
收藏
页码:325 / 329
页数:4
相关论文
共 50 条
  • [1] Optimization of control parameters in micro hot embossing
    He, Yong
    Fu, Jian-Zhong
    Chen, Zi-Chen
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2008, 14 (03): : 325 - 329
  • [2] Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication
    Worgull, M
    Heckele, M
    Hétu, JF
    Kabanemi, KK
    JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS, 2006, 5 (01):
  • [3] Optimization Design and Fabrication of Polymer Micro Needle by Hot Embossing Method
    Samir Sghayer Abubaker
    Yajun Zhang
    International Journal of Precision Engineering and Manufacturing, 2019, 20 : 631 - 640
  • [4] Numerical Modeling, Experimental Investigation, and Optimization of a Micro Hot Embossing Process
    Mondal, Partha Protim
    Ferreira, Placid Matthew
    Kapoor, Shiv Gopal
    Bless, Patrick
    JOURNAL OF MICRO AND NANO-MANUFACTURING, 2024, 11 (03):
  • [5] Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication
    Worgull, M.
    Hetu, J. -F.
    Kabanemi, K. K.
    Heckele, M.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2006, 12 (10-11): : 947 - 952
  • [6] Optimization Design and Fabrication of Polymer Micro Needle by Hot Embossing Method
    Abubaker, Samir Sghayer
    Zhang, Yajun
    INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2019, 20 (04) : 631 - 640
  • [7] Micro hot embossing for replication of micro structures
    Shan, X.C. (maeda-ryutaro@aist.go.jp), 2002, The Japan Society of Applied Physics (Institute of Electrical and Electronics Engineers Inc., United States):
  • [8] Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication
    M. Worgull
    J. -F. Hétu
    K. K. Kabanemi
    M. Heckele
    Microsystem Technologies, 2006, 12 : 947 - 952
  • [9] Micro hot embossing for replication of microstructures
    Shan, XC
    Maeda, R
    Murakoshi, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2003, 42 (6B): : 3859 - 3862
  • [10] Micro hot embossing for replication of microstructures
    Maeda, R. (maeda-ryutaro@aist.go.jp), 1600, Japan Society of Applied Physics (42):