Micromechanical characterization of electroplated permalloy films for MEMS

被引：0
|
作者：
Xueping Li
Guifu Ding
Taeko Ando
Mitsuhiro Shikida
Kazuo Sato
机构：
[1] Shanghai Jiao Tong University,Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Institute of Micro/Nano Science and Technology
[2] Nagoya University,Department of Micro
来源：
Microsystem Technologies | 2008年 / 14卷
关键词：
Tensile Force; Gauge Section; Fracture Strain; Micro Electro Mechanical System; Soft Magnetic Material;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
In order to improve the reliability of MEMS designs, evaluating the mechanical properties of soft magnetic materials is needed. In this paper, we present a tensile testing method to characterize the mechanical properties of microscale electroplated permalloy (80 wt% Ni, 20 wt% Fe) films. The gauge section of the specimen is 50 μm wide, 100 μm long and 5 μm thick. The measured Young’s modulus of permalloy films is 96.4 GPa, and the tensile strength is 1.61 GPa. The fracture strain measured by the images of specimens is about 2%.
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页码：131 / 134
页数：3
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