Investigation of the effect of structural factors and surface composition on the properties of eutectic silver-copper solders used in vacuum technology

被引：0
|
作者：
Kurbatkin I.I. [1 ]
Podgornyi D.A. [2 ]
Chepelenko N.V. [3 ]
机构：
[1] Institute of Problems of Mechanics, Russian Academy of Sciences, Moscow, 119526
[2] Department of Materials Science of Semiconductors and Dielectrics, Moscow State Institute of Steel and Alloys (Technological University), Moscow, 119049
[3] Moscow Plant for Processing of Special Alloys, Moscow
来源：
Russian Journal of Non-Ferrous Metals | 2007年 / 48卷 / 05期
基金：
俄罗斯基础研究基金会;
关键词：
Dark Spot; Silver Chloride; Structural Constituent; Primary Crystal; Electron Microanalysis;
D O I：
10.3103/S1067821207050082
中图分类号：
学科分类号：
摘要：
Structural changes that occur in silver-copper solders during their production with the use of new technological processes are considered. Metallography, electron microanalysis (EMA), and Auger electron analysis (AES) have been used to study changes at the contact surface of the material and their effect on the processes of solder flowing. The contents of alloying elements in phase constituents of the alloy have been determined. The composition of films formed on the surface of the material has been found. The data obtained allowed the optimization of the technological process of fabricating solders and increasing the quality of soldering. © Allerton Press, Inc., 2007.
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页码：349 / 353
页数：4
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