Derivation of mechanical characteristics for Ni/Au intermetallic surface with SAC305 solder

Many surface finish methods are used to connect a substrate with the electric components of IT products in the micro-packaging process, and various types of lead-free solder have been developed as alternative materials to lead-based solder to reduce environmental contamination. However, there has been little research on the mechanical properties of the inter-metallic surface which is generated in the bumping process between the lead-free solder and surface films such as Ni/Au. The present work is to derive the material properties of a Ni/Au inter-metallic surface with SAC305 solder. A series of indentation tests were carried out by changing four nano-scale indentation depths and two strain rates. Also, a reverse algorithm method was adopted to determine the elastic-plastic stress-strain curve based on the load-displacement curve from the indentation test data. As a result of the material characterization effort, the mean elastic modulus, yield strength and strain hardening exponent of IMC with Ni/Au finish were determined.