Corrosion Resistance of Cu-Ni-Si Alloy Under High-Temperature, High-Pressure H2S and Cl− Environments

In this study, Cu-Ni-Si alloy was subjected to corrosion resistance tests under simulated high-temperature, high-pressure H2S and Cl− environments. The corrosion rates, electrochemical performance, surface morphologies, and chemical compositions of the Cu-Ni-Si alloy after corrosion were analyzed by the mass loss method, electrochemical impedance spectroscopy, scanning electron microscopy, energy-dispersive x-ray spectrometry, and x-ray diffraction. The results showed that, at the initial stage of corrosion, because of the loose corrosion product layer initially formed on the surface, a high corrosion rate was observed for the Cu-Ni-Si alloy under high-temperature, high-pressure environments. With the progress of corrosion, the corrosion rate gradually decreased and reached a steady state. Because at the later stage, a passive film was formed on the alloy surface, further inhibiting the corrosion of the alloy and improved its corrosion resistance. The Cu-Ni-Si alloy exhibited good corrosion resistance under high-temperature, high-pressure H2S and Cl− environments.