Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method

被引：0
|
作者：
A. L. Glazov
V. S. Kalinovskii
E. V. Kontrosh
K. L. Muratikov
机构：
[1] Ioffe Institute,
来源：
Technical Physics Letters | 2023年 / 49卷
关键词：
thermal resistance; multi-junction solar cells; lead-free solder; non-destructive testing; thermal waves;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：265 / 268
页数：3
相关论文
共 50 条
  • [1] Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method
    Glazov, A. L.
    Kalinovskii, V. S.
    Kontrosh, E. V.
    Muratikov, K. L.
    TECHNICAL PHYSICS LETTERS, 2023, 49 (12) : 265 - 268
  • [2] Thermal and bending fatigue of PBGA assemblies with lead-free solder pastes
    Jonnalagadda, K
    Bai, T
    Olson, B
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 553 - 558
  • [3] Solder balling of lead-free solder pastes
    Minna Arra
    Dongkai Shangguan
    Erro Ristolainen
    Toivo Lepistö
    Journal of Electronic Materials, 2002, 31 : 1130 - 1138
  • [4] Solder balling of lead-free solder pastes
    Arra, M
    Shangguan, D
    Ristolainen, E
    Lepistö, T
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) : 1130 - 1138
  • [5] Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint
    Surendar, Aravindhan
    Akhmetov, Linar G.
    Ilyashenko, Lubov K.
    Maseleno, Andino
    Samavatian, Vahid
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (10): : 1769 - 1776
  • [6] A comparison of the quality of lead-free solder pastes
    Sitek, J
    Rocak, D
    Bukat, K
    Fajfar-Plut, J
    Belavic, D
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2004, 16 (03) : 22 - 30
  • [7] Accelerated thermal cycling: Is it different for lead-free solder?
    Tunga, K
    Kacker, K
    Pucha, RV
    Sitaraman, SK
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1579 - 1585
  • [8] Thermal simulation of the solidification of lead-free solder interconnections
    Yu, Hao
    Mattila, Toni T.
    Kivilahti, Jorma K.
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (03): : 475 - 485
  • [9] Thermal Conductivity of Molten Lead-Free Solders
    J. Bilek
    J. K. Atkinson
    W. A. Wakeham
    International Journal of Thermophysics, 2006, 27 : 92 - 102
  • [10] Thermal conductivity of molten lead-free solders
    Bilek, J.
    Atkinson, J. K.
    Wakeham, W. A.
    INTERNATIONAL JOURNAL OF THERMOPHYSICS, 2006, 27 (01) : 92 - 102
12345