Microstructural Evolution and Mechanical Properties of Laminated CuAl Composites Processed by Accumulative Roll-Bonding and Annealing

被引:0
|
作者
H. R. Lin
Y. Z. Tian
S. J. Sun
Z. F. Zhang
机构
[1] Chinese Academy of Sciences,Shi
[2] University of Science and Technology of China,changxu Innovation Center for Advanced Materials, Institute of Metal Research
[3] Northeastern University,School of Materials Science and Engineering
[4] Northeastern University,Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Materials Science and Engineering
关键词
CuAl composites; Accumulative roll-bonding (ARB); Annealing; Intermetallic compounds; Ductility;
D O I
暂无
中图分类号
学科分类号
摘要
Nanostructured Cu-/Al-laminated composites were processed by accumulative roll-bonding (ARB) technique for four cycles. Microstructural evolutions inside the Cu and Al layers and the interfacial reactions were revealed after annealing at different temperatures. Recovery and recrystallization occurred in the Cu and Al layers at low annealing temperatures, and three kinds of intermetallic compounds formed near the interfaces. The mechanical properties of these composites after annealing were investigated by tensile tests, and the variation of strength–ductility synergy was comprehensively discussed by considering the roles of constituent and the intermetallic compounds.
引用
收藏
页码:925 / 931
页数:6
相关论文
共 50 条
  • [1] Microstructural Evolution and Mechanical Properties of Laminated CuAl Composites Processed by Accumulative Roll-Bonding and Annealing
    H.R.Lin
    Y.Z.Tian
    S.J.Sun
    Z.F.Zhang
    Acta Metallurgica Sinica(English Letters), 2021, 34 (07) : 925 - 931
  • [2] Microstructural Evolution and Mechanical Properties of Laminated CuAl Composites Processed by Accumulative Roll-Bonding and Annealing
    Lin, H. R.
    Tian, Y. Z.
    Sun, S. J.
    Zhang, Z. F.
    ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2021, 34 (07) : 925 - 931
  • [3] Mechanical behavior and microstructural evolution upon annealing of the accumulative roll-bonding (ARB) processed Al alloy 1100
    Kwan, Charles
    Wang, Zhirui
    Kang, Suk-Bong
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 480 (1-2): : 148 - 159
  • [4] Microstructural evolution and mechanical properties of aluminum-graphite composites processed via accumulative roll bonding
    Biradar, Akash
    Rijesh, M.
    DIAMOND AND RELATED MATERIALS, 2024, 147
  • [5] Microstructural evolution and mechanical properties of ultrafine grained commercially pure 1100 aluminum alloy processed by accumulative roll-bonding (ARB)
    Kim, YS
    Lee, TO
    Shin, DH
    DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, 2004, 449-4 : 625 - 628
  • [6] Microstructural Evolution and Mechanical Behavior of Cu/Nb Multilayer Composites Processed by Accumulative Roll Bonding
    Ding, Chaogang
    Xu, Jie
    Li, Xuewen
    Shan, Debin
    Guo, Bin
    Langdon, Terence G.
    ADVANCED ENGINEERING MATERIALS, 2020, 22 (01)
  • [7] Texture Evolution and Mechanical Properties of Copper/Niobium Laminated Composite Processed Through Accumulative Roll Bonding and Intermediate Annealing
    Goli, Ehsan
    Eghbali, Beitallah
    Sahu, Sandeep
    METALLOGRAPHY MICROSTRUCTURE AND ANALYSIS, 2024, 13 (04) : 657 - 666
  • [8] Microstructures and mechanical properties of 6061 aluminum alloy processed by accumulative roll-bonding
    Lee, SH
    Saito, Y
    Sakai, T
    Utsunomiya, H
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2002, 325 (1-2): : 228 - 235
  • [9] Change in Microstructure and Mechanical Properties of Deoxidized Low-Phosphorous Copper Processed by Accumulative Roll-Bonding with Annealing
    Lee, Seong-Hee
    Kim, Chun-Su
    Kim, Sang-Shik
    Han, Seung-Zeon
    Lim, Cha-Yong
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2007, 17 (07): : 361 - 365
  • [10] Microstructural evolution and mechanical properties of the AA8011 alloy during the accumulative roll-bonding process
    Z. P. Xing
    S. B. Kang
    H. W. Kim
    Metallurgical and Materials Transactions A, 2002, 33 : 1521 - 1530