Study on the effect of carbon nanotube on the properties of electrically conductive epoxy/polyaniline adhesives

被引:0
|
作者
Vinay Khandelwal
Sushanta K. Sahoo
Ashok Kumar
Gaurav Manik
机构
[1] IIT Roorkee Saharanpur Campus,Department of Polymer & Process Engineering
[2] Dr. K. S. Krishnan Marg,CSIR
关键词
D O I
暂无
中图分类号
学科分类号
摘要
Electrically conductive hybrid epoxy (EP) adhesives filled with p-toluenesulfonic acid (PTSA) doped polyaniline (PANI) and carbon nanotubes (CNT) were prepared and their electrical, thermal and morphological properties were investigated. The CNT was incorporated in EP/PANI (1, 3, 5, 7, 10 and 15 wt%) to obtain hybrid composites aiming to achieve better conductivity. Percolation threshold in EP/PANI and EP/CNT binary composites achieved was at around 5% of PANI and 0.2% CNT, respectively. It was observed that the addition of 0.1% CNT in EP/PANI (5%) composites improved the electrical conductivity of composites with a minimal effect on lap shear strength. Differential scanning calorimetry (DSC) studies revealed that while 0.1% CNT addition had an insignificant retardation effect on the curing of EP/PANI (5%), it increased the glass transition temperature (Tg) of cured sample significantly. Although, incorporation of PANI increased the thermal stability of epoxy significantly, addition of CNT further enhanced it marginally in the temperature range of 200–400 °C. FT-IR and XRD spectra of PANI/CNT hybrid fillers system showed molecular level interaction and good dispersing ability of CNT with PANI, respectively. Interestingly, morphological studies showed good dispersion of PANI and CNT in epoxy matrix in binary composites as well as in hybrid composites with no phase separation between PANI and CNT. Optical micrographs showed better dispersion of hybrid PANI/CNT filler system within epoxy matrix compared to PANI only.
引用
收藏
页码:14240 / 14251
页数:11
相关论文
共 50 条
  • [1] Study on the effect of carbon nanotube on the properties of electrically conductive epoxy/polyaniline adhesives
    Khandelwal, Vinay
    Sahoo, Sushanta K.
    Kumar, Ashok
    Manik, Gaurav
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (19) : 14240 - 14251
  • [2] Electrically conductive nanocomposite adhesives based on epoxy or chloroprene containing polyaniline, and carbon nanotubes
    Bakhshali Massoumi
    Monireh Hosseinzadeh
    Mehdi Jaymand
    [J]. Journal of Materials Science: Materials in Electronics, 2015, 26 : 6057 - 6067
  • [3] Electrically conductive nanocomposite adhesives based on epoxy or chloroprene containing polyaniline, and carbon nanotubes
    Massoumi, Bakhshali
    Hosseinzadeh, Monireh
    Jaymand, Mehdi
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (08) : 6057 - 6067
  • [4] Electrically Conductive Epoxy Adhesives
    Sancaktar, Erol
    Bai, Lan
    [J]. POLYMERS, 2011, 3 (01) : 427 - 466
  • [5] Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives
    Lopes, Paulo E.
    Moura, Duarte
    Hilliou, Loic
    Krause, Beate
    Poetschke, Petra
    Figueiredo, Hugo
    Alves, Ricardo
    Lepleux, Emmanuel
    Pacheco, Louis
    Paiva, Maria C.
    [J]. JOURNAL OF COMPOSITES SCIENCE, 2020, 4 (03):
  • [6] The effect of conductive filler on the properties of electrically conductive adhesives(ECAs)
    Hao, Jian
    Wang, Dapeng
    Li, Saipeng
    He, Xinyue
    Zhou, Jian
    Xue, Feng
    [J]. 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 803 - 808
  • [7] Effect of porous copper on the properties of electrically conductive adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (10) : 7771 - 7779
  • [8] Effect of porous copper on the properties of electrically conductive adhesives
    Li-Ngee Ho
    Hiroshi Nishikawa
    [J]. Journal of Materials Science: Materials in Electronics, 2015, 26 : 7771 - 7779
  • [9] Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives
    Tan, FT
    Qiao, XL
    Chen, JG
    Wang, HS
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2006, 26 (06) : 406 - 413
  • [10] A review on epoxy-based electrically conductive adhesives
    Aradhana, Ruchi
    Mohanty, Smita
    Nayak, Sanjay Kumar
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2020, 99