Rapid processing of low-cost, high-efficiency silicon solar cells

Rapid and potentially low-cost processing techniques are analyzed and applied toward the fabrication of high-efficiency Si solar cells. (i) A technology that can simultaneously form the phosphorus emitter, boron BSF, andin situ oxide in a single high-temperature furnace step or: simultaneously diffused, textured, and AR coated process (STAR) is presented. (ii) A high quality screen-printed (SP) contact methodology is developed that results in fill factors of 0·785–0·790 on monocrystalline Si. (iii) Aluminum back surface field (Al-BSF) formation is studied in detail to establish the process conditions that result in optimal BSF action. (iv) Screen-printing of Al conductor paste and rapid thermal processing (RTP) are integrated into the BSF procedure, and effective recombination velocities (Seff) as low as 200 cm/s are demonstrated on 2·3 Ω-cm Si with this rapid thermal processing of screen-printed contacts, Al alloyed BSF processes. (v) A novel passivation scheme consisting of a dielectric stack (plasma silicon nitride on top of a rapid thermal oxide) is developed to reduce the surface recombination velocity (S) to ≈ 10 cm/s at the 1·3 Ω-cm Si surface. The important feature of this stack passivation scheme is its ability to withstand a high-temperature anneal (700–850°C) without degradation in surface recombination velocity. This feature is critical for most current commercial processes that utilize SP contact firing. (vi) Finally, the individual processes are integrated to form high-efficiency, manufacturable devices. Solar cell efficiencies of 17% and >19% are achieved on FZ Si with SP and evaporated (photolithography) contacts, respectively.