Development of a new theory of thermal cutting processes 16. Determining the temperature fields and contact temperatures in cutting (part 2)

被引：0
|
作者：
Vorontsov A.L. [1 ]
Sultan-Zade N.M. [2 ]
Albagachiev A.Y. [3 ]
Savkin A.I.
机构：
[1] Bauman Moscow State Technical University, Moscow
[2] Moscow State Industrial University, Moscow
[3] Moscow State University of Instrument Engineering and Information Sciences, Moscow
来源：
Russian Engineering Research | 2011年 / 31卷 / 4期
关键词：
Heat Flux; Temperature Field; Tangential Stress; RUSSIAN Engineer Research; Dimensionless Temperature;
D O I：
10.3103/S1068798X11040277
中图分类号：
学科分类号：
摘要：
Thermal processes at the cutter-blank surface and the chip-cutter surface are investigated. © 2011 Allerton Press, Inc.
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收藏
页码：369 / 375
页数：6
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