Effect of imides on nickel-tungsten alloy electroforming

被引：0
|
作者：
Chein-Ho Huang
机构：
来源：
Journal of Materials Science | 1999年 / 34卷
关键词：
Polymer; Thermal Treatment; Internal Stress; Imide; Sulfamate;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Electroformed nickel-tungsten alloy with low internal stress has been obtained in a sulfamate solution by using organic imides namely bis(benzene-sulfonyl)imide and ortho-benzosulfimide as stress-reducing agents. Concurrently, the hardness of the alloy electroforms thus obtained was increased by these imides, especially the ortho-benzosulfimide. The effect of imides on hardness after thermal treatment of the alloy electroforms is also studied.
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页码：1373 / 1377
页数：4
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