Micro-hole processing of polyimide film by ultra-short laser pulses and its applications

Micro machining of a polyimide film with ultra-short pulsed laser was demonstrated. A through-hole with a diameter of less than 10 μm could be produced by optimizing the pulse duration, repetition rate, and number of shots. Thermal damage around the through-hole can be made negligibly small when the pulse duration was shorter than 140 fs. We also found that the minimum shot number needed for the creation of a through-hole becomes smaller as the repetition rate of laser shot increases. On the basis of the optimum irradiation condition, we demonstrated laser cutting of a polyimide film without thermal damage and copper filling in through-holes with diameters of 9 μm by a plating process.