A New Submodule for Capacitor Voltage Ripple Reduction with Fewer Semiconductor Components in Modular Multilevel Converters

被引:0
|
作者
S. Yousofi-Darmian
S. Masoud Barakati
机构
[1] University of Sistan and Baluchestan,Faculty of Engineering
[2] Sistan and Baluchestan Regional Electric Company,Deputy of Research and Planning
关键词
MMC; Voltage ripple; Capacitor parallel connection; Three-level submodule;
D O I
暂无
中图分类号
学科分类号
摘要
The size of energy storage resources has a vital role in the cost, size, and weight of power electronics converters. Multilevel converters usually operate at low switching frequencies to prevent high switching loss. Since modular multilevel converters are constructed of a series connection of some submodules, a lower switching frequency causes a higher capacitor voltage ripple. To deal with this issue, the size of converter capacitors has to be increased. This paper presents a new submodule (SM) that enables the parallel connection of capacitors. This SM decreases the ripple of the capacitors and offers three-level voltage at its terminals. In addition, it uses fewer switching devices and gate driver circuits in comparison with other submodules presented in the literature. Also, the number of capacitor voltage sensors is reduced by half due to the parallel connection of SM capacitors. The simulation and experimental results verify the performance of the proposed submodule.
引用
收藏
页码:1307 / 1318
页数:11
相关论文
共 50 条
  • [1] A New Submodule for Capacitor Voltage Ripple Reduction with Fewer Semiconductor Components in Modular Multilevel Converters
    Yousofi-Darmian, S.
    Barakati, S. Masoud
    [J]. IRANIAN JOURNAL OF SCIENCE AND TECHNOLOGY-TRANSACTIONS OF ELECTRICAL ENGINEERING, 2023, 47 (04) : 1307 - 1318
  • [2] Capacitor Voltage Ripple Minimization in Modular Multilevel Converters
    Perez, Marcelo A.
    Bernet, Steffen
    [J]. 2015 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL TECHNOLOGY (ICIT), 2015, : 3022 - 3027
  • [3] Submodule Capacitor Dimensioning for Modular Multilevel Converters
    Baernklau, Hans
    Gensior, Albrecht
    Bernet, Steffen
    [J]. 2012 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2012, : 4172 - 4179
  • [4] Submodule Capacitor Dimensioning for Modular Multilevel Converters
    Baernklau, Hans
    Gensior, Albrecht
    Bernet, Steffen
    [J]. IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2014, 50 (03) : 1915 - 1923
  • [5] A new submodule structure with parallel capacitor connection in modular multilevel converters
    Bharath, G. Veera
    Gohil, Ghanshyamsinh
    Balsara, Poras T.
    [J]. 2022 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS 22), 2022, : 1382 - 1386
  • [6] Capacitor Ripple Reduction with Novel Modulation Scheme in Modular Multilevel Converters
    Rahmati, Saman
    Veysinejad, Aria
    Bina, Mohammad Tavakoli
    [J]. 2020 11TH POWER ELECTRONICS, DRIVE SYSTEMS, AND TECHNOLOGIES CONFERENCE (PEDSTC), 2020,
  • [7] Distributed Neural Network Observer for Submodule Capacitor Voltage Estimation in Modular Multilevel Converters
    Poblete, Pablo
    Pizarro, German
    Droguett, Gabriel
    Nunez, Felipe
    Judge, Paul D.
    Pereda, Javier
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2022, 37 (09) : 10306 - 10318
  • [8] Submodule Capacitor Lifetime Increment Method for Modular Multilevel Converters
    Wang, Zichen
    Liu, Zhi Jie
    Gu, Zhonglin
    Li, Ke-Jun
    Ge, Xiaoxue
    [J]. 2023 IEEE/IAS INDUSTRIAL AND COMMERCIAL POWER SYSTEM ASIA, I&CPS ASIA, 2023, : 238 - 243
  • [9] A New Three-Level Switched-Capacitor Submodule for Modular Multilevel Converters
    Elserougi, Ahmed
    Ahmed, Shehab
    Massoud, Ahmed
    [J]. PROCEEDINGS 2016 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL TECHNOLOGY (ICIT), 2016, : 234 - 239
  • [10] Analysis and Suppression of the Capacitor Voltage Ripple for Hexverter-Based Modular Multilevel Converters
    Yang, Fan
    Wang, Xiaohong
    Guo, Haishan
    Yang, Hemin
    Huo, Zhixin
    Jian, Youzong
    Hu, Jing
    [J]. PROCEEDINGS OF THE 3RD INTERNATIONAL SYMPOSIUM ON NEW ENERGY AND ELECTRICAL TECHNOLOGY, 2023, 1017 : 108 - 120