High heat loading performance of actively cooled W/Cu FGM-based components

被引:0
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作者
Zhang-jian Zhou
Jun Tan
Dan-dan Qu
Hua Li
Young-jin Yum
Hyun-woo Lim
机构
[1] University of Science and Technology Beijing,School of Materials Science and Engineering
[2] Electronic Engineering Institute,School of Mechanical & Automotive Engineering
[3] University of Ulsan,undefined
关键词
tungsten; copper; functionally graded materials; thermal load;
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摘要
A functionally graded material-based actively water-cooled tungsten-copper mockup with a dimension of 30 mm×30 mm×25 mm was designed and fabricated by infiltration-brazing method. The thicknesses of the pure W layer and W/Cu graded layer were 2 and 3 mm, respectively. High heat flux tests were performed on the mockup using an e-beam device. There is no damage occurring on the joint after heat loading at 5 MW/m2. The temperature on the pure W surface is less than 500°C after irradiation for 100 s at 5 MW/m2, while the temperature on the brazing seam/copper surface is around 200°C.
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页码:467 / 471
页数:4
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