Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

被引：0
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作者：
Seok-Bon Koo
Chang-Myeon Lee
Sang-Jun Kwon
Jun-Mi Jeon
Jin-young Hur
Hong-Kee Lee
机构：
[1] Korea Institute of Industrial Technology,Surface Technology R&D Group
[2] Korea Institute of Science and Technology,Advanced Analysis Center
来源：
Metals and Materials International | 2019年 / 25卷
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摘要：
Unfortunately, the acknowledgements were missing in the original version of this article. The information is given below: 
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页码：821 / 821
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