3D Printed Bioelectronic Platform with Embedded Electronics

被引:0
|
作者
Shweta Agarwala
Jia Min Lee
Wai Yee Yeong
Michael Layani
Shlomo Magdassi
机构
[1] School of Mechanical and Aerospace Engineering,Singapore Centre for 3D Printing (SC3DP)
[2] Nanyang Technological University (NTU),Institute of Chemistry, Casali Center for Applied Chemistry
[3] Hebrew University of Jerusalem,undefined
关键词
D O I
10.1557/adv.2018.431
中图分类号
学科分类号
摘要
Silver nanoparticle based microelectrodes embedded between layers of hydrogel material were successfully fabricated. 3D bioprinting is employed to print the entire bioelectronics platform comprising of conducting silver ink and Gelatin methacryloyl (GelMA) hydrogel. The additive manufacturing technique of bioprinting gives design freedom for the circuit, saves material and shortens the time to fabricate the bioelectronics platform. The silver platform shows excellent electrical conductivity, structural flexibility and stability in wet environment. It is tested for biocompatibility using C2C12 murine myoblasts cell line. The work demonstrates the potential of the fabricated platform for the realization of practical bioelectronic devices.
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页码:3011 / 3017
页数:6
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