Review of electrochemical discharge machining technology for insulating hard and brittle materials

被引:0
|
作者
Lei Zhang
Linglei Kong
Weining Lei
Qilin Li
机构
[1] Jiangsu University of Technology,School of Mechanical Engineering
[2] Jiangsu University of Technology,Changzhou Key Laboratory of Precision Special Forming of Materials
关键词
ECDM; Gas film; Processing performance; Electrode structure; Electrode rotation; Fluid-assisted machining; Electrolyte; Hybrid ECDM;
D O I
暂无
中图分类号
学科分类号
摘要
With excellent characteristics such as strong wear resistance, high hardness and good insulation, insulating hard and brittle materials such as optical glass and engineering ceramics are widely applied in modern industry. However, it is very difficult to machine these advanced insulating hard and brittle materials with traditional machining methods such as cutting or grinding, by which the dimensional accuracy or processing efficiency is very low. Electrochemical discharge machining (ECDM) process is an emerging non-traditional machining process that relies on spark discharge and chemical etching to etch materials and has great potential for machining various insulating hard and brittle materials. This paper introduces the gas film formation process and material etching mechanism during ECDM and summarizes the current research status in terms of electrical parameters, electrode structure, electrode motion, auxiliary liquid supply, and electrolytes that affect the processing performance of ECDM. Multi-energy field combined processing techniques have also attracted the interest of researchers. Various hybrid machining processes are introduced. Finally, the currently researches are summarized and some improvement measures that can improve the processing performance of ECDM are discussed for future research.
引用
收藏
相关论文
共 50 条
  • [1] Review of electrochemical discharge machining technology for insulating hard and brittle materials
    Zhang, Lei
    Kong, Linglei
    Lei, Weining
    Li, Qilin
    [J]. JOURNAL OF THE BRAZILIAN SOCIETY OF MECHANICAL SCIENCES AND ENGINEERING, 2024, 46 (03)
  • [2] Machining characteristics of hard and brittle insulating materials with mist-jetting electrochemical discharge
    Zhidong Liu
    Haoran Chen
    Jianyuan Yu
    Huijun Pan
    [J]. The International Journal of Advanced Manufacturing Technology, 2015, 79 : 815 - 822
  • [3] Machining characteristics of hard and brittle insulating materials with mist-jetting electrochemical discharge
    Liu, Zhidong
    Chen, Haoran
    Yu, Jianyuan
    Pan, Huijun
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2015, 79 (5-8): : 815 - 822
  • [4] An Investigation into Laser-Assisted Electrochemical Discharge Machining of Transparent Insulating Hard-Brittle Material
    Zhao, Douyan
    Zhang, Zhaoyang
    Zhu, Hao
    Cao, Zenghui
    Xu, Kun
    [J]. MICROMACHINES, 2021, 12 (01) : 1 - 12
  • [5] Machining of hard and brittle materials: A comprehensive review
    Sharma, Ankit
    Kalsia, Mohit
    Uppal, Amrinder Singh
    Babbar, Atul
    Dhawan, Vikas
    [J]. MATERIALS TODAY-PROCEEDINGS, 2022, 50 : 1048 - 1052
  • [6] Study of electrochemical discharge machining technology for slicing non-conductive brittle materials
    Peng, WY
    Liao, Y
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2004, 149 (1-3) : 363 - 369
  • [7] Ultrasonic technology revolutionises the machining of brittle-hard materials
    Vogt, B
    [J]. INDUSTRIAL DIAMOND REVIEW, 2002, 62 (04): : 242 - +
  • [8] HYBRID MACHINING OF HARD AND BRITTLE MATERIALS
    KOSHIMIZU, S
    IANSAKI, I
    [J]. JOURNAL OF MECHANICAL WORKING TECHNOLOGY, 1988, 17 : 333 - 341
  • [9] Study on Electroplating Technology of Diamond Tools for Machining Hard and Brittle Materials
    Cui, Ying
    Chen, Jian Hua
    Sun, Li Peng
    Wang, Yue
    [J]. ADVANCED OPTICAL MANUFACTURING TECHNOLOGIES, 2016, 9683
  • [10] Micromechanics of machining and wear in hard and brittle materials
    Lawn, Brian R.
    Borrero-Lopez, Oscar
    Huang, Han
    Zhang, Yu
    [J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2021, 104 (01) : 5 - 22