Warpage phenomenon of thin-wall injection molding

被引:1
|
作者
Yuh-Chyun Chiang
Hsin-Chung Cheng
Chiung-Fang Huang
Jeou-Long Lee
Yi Lin
Yung-Kang Shen
机构
[1] Taiwan Adventist Hospital,Department of Otolaryngology
[2] Taipei Medical University Hospital,School of Dentistry, College of Oral Medicine
[3] Taipei Medical University,Division of Family and Operative Dentistry
[4] Department of Dentistry,Department of Chemical and Material Engineering
[5] Taipei Medical University Hospital,Department of Business Administration
[6] Lunghwa University of Science and Technology,Graduate Institute of Industrial and Business Management
[7] Takming University of Science and Technology,Bio
[8] National Taipei University of Technology,Medical Nano/μ Forming Laboratory, School of Dental Technology, College of Oral Medicine
[9] Taipei Medical University,Research Center for Biomedical Implants and Microsurgery Devices
[10] Taipei Medical University,Research Center for Biomedical Devices
[11] Taipei Medical University,undefined
关键词
Thin-wall injection molding; Taguchi method; Warpage; Molding window;
D O I
暂无
中图分类号
学科分类号
摘要
This study investigates warpage of electronic dictionary battery covers fabricated using thin-wall injection molding as a replacement for conventional insert molding. The primary concern is the molding window in thin-wall injection molding for acrylonitrile–butadiene styrene (ABS) and polycarbonate (PC)+ABS plastics. Finally, the process parameters for thin-wall injection molding that eliminate warpage of electronic dictionary battery covers are identified. Experimental results demonstrate that the area of the molding window for ABS exceeds that for PC+ABS. Analysis of the molding window reveals that ABS is more appropriate than PC+ABS for battery covers. Low melt temperature, high injection speed, and high packing pressure eliminate battery cover warpage. Melt temperature is the most important process parameter for eliminating warpage when using both ABS and PC+ABS.
引用
收藏
页码:517 / 526
页数:9
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