Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, Inc., Hoboken, NJ

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Journal of Thermal Spray Technology | 2007年 / 16卷 / 1期

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10.1007/s11666-007-9013-z

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页码：153 / 165

页数：12

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[1] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, Inc., Hoboken, NJ
[J]. Journal of Thermal Spray Technology, 2009, 18 (1) : 118 - 129
[2] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, Inc., Hoboken, NJ
[J]. Journal of Thermal Spray Technology, 2007, 16 (2) : 306 - 317
[3] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, Inc., Hoboken, NJ, USA
[J]. Journal of Thermal Spray Technology, 2007, 16 (3) : 449 - 461
[4] Selected abstracts of thermal spray literatureReprinted with permission from Elsevier Engineering Information, Inc., Hoboken, NJ, USA
[J]. Journal of Thermal Spray Technology, 2003, 12 (1) : 120 - 152
[5] Selected abstracts of thermal spray literatureReprinted with permission from Elsevier Engineering Information, Inc., Hoboken, NJ, USA
[J]. Journal of Thermal Spray Technology, 2003, 12 (4) : 576 - 596
[6] Selected abstracts of thermal spray literatureReprinted with permission from elsevier engineering information, Inc., Hoboken, NJ, USA
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[7] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, New York, NY
[J]. Journal of Thermal Spray Technology, 2009, 18 (2) : 297 - 308
[8] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, New York, NY
[J]. Journal of Thermal Spray Technology, 2009, 18 (4) : 714 - 726
[9] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, New York, NY
[J]. Journal of Thermal Spray Technology, 2008, 17 (2) : 289 - 296
[10] Selected Abstracts of Thermal Spray LiteratureReprinted with permission from Elsevier Engineering Information, New York, NY
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