Diffusion Bonding of Ti-6Al-4V Sheet with Ti-6Al-4V Foam for Biomedical Implant Applications

被引:0
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作者
Brittany Hamilton
Scott Oppenheimer
David C. Dunand
Daniel Lewis
机构
[1] Rensselaer Polytechnic Institute,Department of Materials Science and Engineering
[2] Northwestern University,Department of Materials Science and Engineering
[3] General Electric Corporation,undefined
关键词
Foam; Bonding Condition; Bonding Temperature; Diffusion Bonding; Ductile Failure;
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学科分类号
摘要
Advanced metallic bone implants are designed to have a porous surface to improve osseointegration and reduce risks of loosening. An alternative approach to existing surface treatments to create a porous surface is to bond separately produced metallic foams onto the implant. To assess the feasibility of this approach, a Ti-6Al-4V foam was diffusion bonded onto bulk Ti-6Al-4V in an argon atmosphere at temperatures between 1173 K and 1223 K (900 °C and 950 °C) for times between 45 and 75 minutes. These specimens were tested in tension to determine bond quality: failures occurred in the foam, indicating a strong diffusion-bonded interface. The quality of the bond was confirmed by metallographic studies, indicating that this approach, which can also be applied to creating of sandwich with porous cores, is successful.
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页码:1554 / 1559
页数:5
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