Preliminary biocompatibility experiment of polymer films for laser-assisted tissue welding

被引:11
|
作者
Sorg, BS [1 ]
Welch, AJ [1 ]
机构
[1] Univ Texas, Biomed Engn Program, Austin, TX 78712 USA
关键词
albumin solder; breaking strength; diode laser; poly(DL-lactic-co-glycolic acid); rat skin;
D O I
10.1002/lsm.10156
中图分类号
R75 [皮肤病学与性病学];
学科分类号
100206 ;
摘要
Background and Objectives: The purpose of this study was to examine the impact of a polymer film for liquid solder strength reinforcement on the short term healing of a wound closed by laser-tissue soldering. Materials and Methods: Full thickness incisions created on the dorsum of Sprague-Dawley rats were closed by laser-tissue soldering: albumin solder with Indocyanine Green (ICG) dye was inserted between the incision edges and photothermally coagulated with a diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) polymer film was implanted subcutaneously in the bottom of the incision (controls had no film). Specimens were harvested at 0, 3, 7, and 14 days for breaking strength testing and histological analysis. Results: Breaking strengths of the controls at 0 and 14 days were statistically stronger than the specimens with the implanted films (t-test, P < 0.05). A slight difficulty in apposing the wound edges due to the film presence may have contributed to the low acute strengths. Interference with the wound contraction process by the films possibly contributed to the lower breaking strength at 14 days. Wound histology indicated a mild foreign body reaction to the polymer film material. Conclusions: The polymer film was well tolerated by the tissue, and the tissue response to the material was consistent with that seen in the literature. The breaking strength differences between control and film-implanted specimens at 0 and 14 days were probably the result of mechanical complications (tissue apposition and wound contraction) due to the presence of the film, and not due to the film material itself. The use of polymer film patches for liquid solder reinforcement and breaking strength enhancement may have certain application specific issues that need to be addressed. Strategies to account for these issues require further research. (C) 2003 Wiley-Liss, Inc.
引用
收藏
页码:215 / 223
页数:9
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