Effect of sintering control on new BaTiO3 of Ni internal electrode paste film by MLCC

When the synthesis of a yet thinner layer of Ni electrode paste is considered, the shrinkage rate of the Ni electrode paste film must be close to that of a dielectric green sheet. However, the shrinkage rate of Ni electrode paste film synthesized by the WCP or CVD method without any additive is far from that of a dielectric green sheet. Under this circumstance, the use of BaTiO3 organometal resinate, which has the same composition as ceramics, as an additive is examined. The result indicates that it is possible to suppress sintering of the Ni electrode paste film by adding BaTiO3 organometal resinate, compared to that without such addition; as a result, the shrinkage rate approaches that of a dielectric green sheet. Furthermore, the resistivity of the Ni electrode paste film with BaTiO3 organometal reginate is lower than that of film without the additive. The results of this study, as discussed above, have clarified that Ni paste with added BaTiO3 organometal reginate has superior electrical characteristics.