共 50 条
- [1] High-Frequency Modeling and Signal Integrity Analysis of High-Density Silicone Rubber Socket [J]. 2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM, 2016, : 55 - 57
- [2] High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (12): : 2152 - 2162
- [3] Signal Integrity Analysis of a High-Performance Processor Package with Silicon Interposer [J]. 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 833 - 837
- [5] HIGH-FREQUENCY MODELING AND CHARACTERIZATION OF HIGH-PERFORMANCE DFB LASER MODULES [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (03): : 412 - 417
- [9] METHODS FOR HIGH-FREQUENCY SIGNAL ANALYSIS [J]. AEU-ARCHIV FUR ELEKTRONIK UND UBERTRAGUNGSTECHNIK-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 1987, 41 (03): : 149 - 155