Material design of negative-tone polyphenol resist for EUV and EB lithography

被引:3
|
作者
Kojima, Kyoko [1 ]
Mori, Shigeki [2 ]
Shiono, Daiju [3 ]
Hada, Hideo [3 ]
Onodera, Junichi [3 ]
机构
[1] Hitachi Ltd, Cent Res Lab, Tokyo 1858601, Japan
[2] Hitachi ULSI Sys Co Ltd, Tokyo 1850014, Japan
[3] Tokyo Ohka Kogyo Co Ltd, Kanagawa 2530114, Japan
关键词
negative-tone; polyphenol; polarity change; EB lithography; lactonization; resist;
D O I
10.1117/12.711759
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to enable design of a negative-tone polyphenol resist using polarity-change reaction, five resist compounds (3M6C-MBSA-BLs) with different number of functional group of gamma-hydroxycarboxyl acid were prepared and evaluated by EB lithography. The resist using mono-protected compound (3M6C-MBSA-BL1a) showed 40-nm hp resolution at an improved dose of 52 mu C/cm(2) probably due to removal of a non-protected polyphenol while the sensitivity of the resist using a compound of protected ratio of 1.1 on average with distribution of different protected ratio was 72 mu C/cm(2). For evaluation of the di-protected compound based resist, a di-protected polyphenol. was synthesized by a newly developed synthetic route of 3-steps reaction, which is well-suited for mass production. The resist using di-protected compound (3M6C-MBSA-BL2b) also showed 40-nm hp resolution at a dose of 40 mu C/cm(2), 14 which was faster than that of mono-protected resist. Fundamental EUV lithographic evaluation of the resist using 3M6C-MI3SA-BL2b by an EUV open frame exposure tool (EUVES-7000) gave its estimated optimum sensitivity of 7 14 mJ/cm(2) and a proof of fine development behavior without any swelling.
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页数:9
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