Finite Element Analysis Model of a PV Junction Box for Thermal Assessment

This study describes a methodology for Finite Element Analysis (FEA) based thermal modelling of a design of a Photovoltaic (PV)junction box (Jbox) for assessing its heat dissipation capability under test conditions prescribed in qualification standards IEC 62790 / IEC 61215. The effect of parameters such as wind speed, power dissipation in the diode and thermal conductivity of potting material on the diode junction temperature are explored. COMSOL Multiphysics was used for developing the geometry, defining physics and computing the temperature distributions. This model can be used for comparative thermal assessment of various Jbox designs pre-manufacturing and pre-certification for de-risking the new designs.