Prognostics of Power MOSFET Due to Unclamped Inductive Switching

被引:0
|
作者
Khera, Neeraj [1 ]
Tiwari, Sharad [2 ]
机构
[1] Amity Univ, Dept ECE, Noida, Uttar Pradesh, India
[2] Amity Univ, Dept EEE, Noida, Uttar Pradesh, India
关键词
Accelerated Aging Test; Junction Temperature; Real-time Prognostics; Unclamped Inductive Switching; ELECTRONIC CONVERTERS; RELIABILITY;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
In this paper the real time prognostics of power MOSFET is presented experimentally through repetitive unclamped inductive switching based accelerated aging test. As per MIL Handbook 217F, the failure rate of electrolytic capacitors is very high followed by switching transistors. In power electronic systems power MOSFETs are preferred switching transistors for high frequency applications. The practical reliability of MOSFET is much different from their datasheet due to the thermal stress arising from the real time operation. In this paper, the wear out conditions of MOSFET due to avalanche energy stress is determined from the junction temperature rise due to unclamped inductive switching based accelerated aging test. The test will help in selecting the switching power MOSFET for the power electronic converters.
引用
收藏
页数:4
相关论文
共 50 条
  • [1] Dynamics of power MOSFET switching under unclamped inductive loading conditions
    Fischer, K
    Shenai, K
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (06) : 1007 - 1015
  • [2] Electrothermal effects during unclamped inductive switching (UIS) of power MOSFET's
    Fischer, K
    Shenai, K
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (05) : 874 - 878
  • [3] Evaluation of SiC MOSFET power modules under unclamped inductive switching test environment
    Nawaz, Muhammad
    MICROELECTRONICS RELIABILITY, 2016, 63 : 97 - 103
  • [4] A new thermal model for power mosfet devices accounting for the behavior in unclamped inductive switching
    Agnone, A.
    Chimento, F.
    Musumeci, S.
    Raciti, A.
    Privitera, G.
    2007 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-6, 2007, : 1006 - 1012
  • [5] A new thermal model for power MOSFET devices accounting for the behavior in unclamped inductive switching
    Raciti, Angelo
    Musumeci, Salvatore
    Chimento, Filippo
    Privitera, Giovanni
    MICROELECTRONICS RELIABILITY, 2016, 58 : 3 - 11
  • [6] A novel superjunction MOSFET with improved ruggedness under unclamped inductive switching
    Ren Min
    Li Ze-Hong
    Deng Guang-Min
    Zhang Ling-Xia
    Zhang Meng
    Liu Xiao-Long
    Xie Jia-Xiong
    Zhang Bo
    CHINESE PHYSICS B, 2012, 21 (04)
  • [7] A novel superjunction MOSFET with improved ruggedness under unclamped inductive switching
    任敏
    李泽宏
    邓光敏
    张灵霞
    张蒙
    刘小龙
    谢加雄
    张波
    Chinese Physics B, 2012, (04) : 616 - 622
  • [8] A Bi-Dimensional Model for Power MOSFET Devices Accounting for the Behavior in Unclamped Inductive Switching Conditions
    Raciti, A.
    Musumeci, S.
    Xibilia, F.
    Chimento, F.
    Privitera, G.
    39TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2013), 2013, : 134 - 139
  • [9] Comparison Investigations on Unclamped-Inductive-Switching Behaviors of Power GaN Switching Devices
    Li, Sheng
    Liu, Siyang
    Zhang, Chi
    Qian, Le
    Xin, Shuxuan
    Ge, Chen
    Sun, Weifeng
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2022, 69 (05) : 5041 - 5049
  • [10] Prognostics of Power MOSFET
    Celaya, Jose R.
    Saxena, Abhinav
    Vashchenko, Vladislav
    Saha, Sankalita
    Goebel, Kai
    2011 IEEE 23RD INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2011, : 160 - 163