Effect of surface Finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMs package

被引：0

作者：

Koo, Ja-Myeong ^{[1
]}

Jung, Seung-Boo ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, 300 Cheoncheon Dong, Suwon 440746, South Korea

来源：

DTIP 2006: SYMPOSIUM ON DESIGN,TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2006 | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni-3(Sn,In)(4) and Cu-6(Sn,In)(5) intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu-6(Sn,In)(5) and Cu(Sn,In)(2) IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

引用

页码：131 / +

页数：2

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