Investigation on LG=50 nm Tapered T-Gated AlGaN/GaN HEMT on Silicon Wafer with a fT/fmax of 264/312 GHz for beyond 5G (B5G) Applications

被引:1
|
作者
Kumar, J. S. Raj [1 ]
Nirmal, D. [1 ]
Ajayan, J. [2 ]
Tayal, Shubham [2 ]
机构
[1] Karunya Inst Technol & Sci, Dept Elect & Commun Engn, Coimbatore, Tamil Nadu, India
[2] SR Univ, Dept Elect & Commun Engn, Warangal, Telangana, India
关键词
AlGaN; GaN; HEMT; Mini-field plate; Power amplifier; Silicon; Tapered T-gate; ELECTRON-MOBILITY TRANSISTORS; GAN HEMTS; BREAKDOWN VOLTAGE; MIS-HEMT; PERFORMANCE; POWER; WELL;
D O I
10.1007/s12633-022-01860-y
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The impact of mini-field plated tapered T-Gate and conventional gate on L-G = 50 nm AlGaN/GaN on - Silicon High Electron Mobility Transistor (HEMT) is analyzed and its DC/RF performance is reported in this work. The AlGaN/GaN HEMT supported with mini-filed plated tapered T- gate structure provides a maximum drain current of 1.53 A/mm when compared to conventional gate structure HEMT which is 0.8 A/mm. This work also examines, a brief analysis of mini-filed plated tapered T-gate structured HEMT for different work functions and different temperatures. The novel mini-filed plated tapered T-Gate structured HEMT on Silicon offers a higher cutoff frequency f(T) of 264 GHz and maximum oscillation frequency f(MAX) of 312 GHz which provides a great potential for future beyond 5G (B5G) applications.
引用
收藏
页码:11315 / 11322
页数:8
相关论文
共 6 条
  • [1] Investigation on LG = 50 nm Tapered T-Gated AlGaN/GaN HEMT on Silicon Wafer with a fT/fmax of 264/312 GHz for beyond 5G (B5G) Applications
    J. S. Raj Kumar
    D. Nirmal
    J. Ajayan
    Shubham Tayal
    Silicon, 2022, 14 : 11315 - 11322
  • [2] Performance analysis of metal gate engineered junctionless nanosheet fet with a ft/fmax of 224/342ghz for beyond 5g (b5g) applications
    Valasa, Sresta
    Tayal, Shubham
    Thoutam, Laxman Raju
    MICRO AND NANOSTRUCTURES, 2023, 179
  • [3] LG = 50 nm T-gated and Fe-doped double quantum well GaN-HEMT on SiC wafer with graded AlGaN barrier for future power electronics applications
    Mounika, B.
    Ajayan, J.
    Bhattacharya, Sandip
    Nirmal, D.
    Dwivedi, Amit Krishna
    JOURNAL OF SCIENCE-ADVANCED MATERIALS AND DEVICES, 2024, 9 (04):
  • [4] 40-nm RFSOI technology exhibiting 90fs RON x COFF and fT/fMAX of 250 GHz/350 GHz targeting sub-6 GHz and mmW 5G applications
    Cremer, S.
    Pelloux, N.
    Gianesello, F.
    Mourier, Y.
    Haury, G.
    de Albuquerque, T. Chaves
    Monsieur, F.
    Audouin, H.
    Legrand, C. A.
    Diouf, C.
    Goncalves, J. Azevedo
    Goncalves, C. Belem
    Durand, C.
    Vulliet, N.
    Berthier, L.
    Souchier, E.
    Garcia, P.
    Jan, S.
    Hello, M.
    Rellier, M. L.
    Scheer, P.
    Duriez, B.
    Garros, X.
    Bordignon, T.
    Paillardet, F.
    Chevalier, P.
    IEEE 53RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, ESSDERC 2023, 2023, : 101 - 104
  • [5] Investigation on DC/RF Performance of LG=19 nm Heterogeneous Integrated Ga0.15In0.85As/InAs/Ga0.15In0.85As Composite Channel InP HEMT on Silicon Substrate for Future Beyond 5G and Quantum Computing Applications
    Bhattacharya, Sandip
    Ajayan, J.
    Nirmal, D.
    Tayal, Shubham
    Kollem, Sreedhar
    Joseph, L. M. I. Leo
    SILICON, 2022, 14 (15) : 9581 - 9588
  • [6] Investigation on DC/RF Performance of LG = 19 nm Heterogeneous Integrated Ga0.15In0.85As/InAs/Ga0.15In0.85As Composite Channel InP HEMT on Silicon Substrate for Future Beyond 5G and Quantum Computing Applications
    Sandip Bhattacharya
    J. Ajayan
    Shubham D.Nirmal
    Sreedhar Tayal
    L. M. I. Leo Kollem
    Silicon, 2022, 14 : 9581 - 9588