Impact of Package Parasitics on the EMC Performance of Smart Power SoCs

被引：0
|
作者：
Merlin, Marco [1 ]
Fiori, Franco [2 ]
机构：
[1] Ist Super Mario Boella, Via PC Boggio 61, I-10138 Turin, Italy
[2] Politecn Torino, I-10129 Turin, Italy
来源：
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 | 2009年
关键词：
electromagnetic emission; package parasitics; switching noise; smart power; substrate grounding;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper deals with the propagation of EMI in Smart Power SoCs through high frequency parasitic paths, i.e. silicon substrate, and it focuses on the interaction between on-chip parasitic capacitors and pack-age parasitic elements, that negatively affects IC electromagnetic emission. The paper highlights such unwanted parasitic effects through computer simulations and experimental test results. Finally, a new grounding scheme to improve the EMC performance of such integrated circuits is presented
引用
收藏
页码：437 / +
页数：2
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